IEEE press

Éditeur
E-book, A Hardware-in-Loop Digital Twin Approach for Intelligent Optimization of Municipal Solid Waste Incineration : AI and Its Application to Complex Industrial Processes, IEEE Press
E-book, Internet of Things A to Z : Technologies and Applications, IEEE Press
E-book, Concentrated Solar Power Systems, IEEE Press
E-book, Data-Driven Energy Management and Tariff Optimization in Power Systems : Shaping the Future of Electricity Distribution through Analytics, IEEE Press
E-book, Machine Learning and AI with Simple Python and Matlab Scripts : Courseware for Non-computing Majors, IEEE Press
E-book, Reconfigurable Intelligent Surfaces for 6G and Beyond Wireless Networks, IEEE Press
E-book, New Space : From Low Earth Orbit to the Moon and Beyond, IEEE Press
E-book, Wind Energy Landscape : Principles, Techniques, History, IEEE Press
E-book, State Estimation of Multi-Agent Vehicle-Road Interaction Systems, IEEE Press
E-book, Wireless Sensor Networks in Smart Environments : Enabling Digitalization from Fundamentals to Advanced Solutions, IEEE Press
E-book, Defense in Depth : Modern Cybersecurity Strategies and Evolving Threats, IEEE Press
E-book, Tunable Evanescent-Mode Filters : Principles, Implementation, and Applications, IEEE Press
E-book, Mathematics for the Digital Systems Engineer : Essentials for Modern Cryptography, Computer Security and Communications Technology, IEEE Press
E-book, Block Diagram Implementation for Control Systems : Including MATLAB Programming, Microsoft Word and PowerPoint Presentation, IEEE Press
E-book, Deep Learning Enabled Semantic Communications, IEEE Press
E-book, Modern Power System, IEEE Press
E-book, Green Innovations in Supply Chain Management : Case Studies and Applications, IEEE Press
E-book, Advanced Techniques for Optimal Sizing of Analog Integrated Circuits : Quantum Computing, Machine Learning, and Bio-inspired Optimization, IEEE Press
E-book, Communities for Clean Energy Justice and Equity in Grid Modernization, IEEE Press
E-book, Stochastic Finite Element Modeling in Electronic Packaging, IEEE Press
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